Compaq F500 Laptop User Manual


 
4. Remove the fan/heat sink assembly (3).
NOTE: Due to the adhesive quality of the thermal paste and thermal pads located between
the fan/heat sink assembly and system board components, it may be necessary to move the
fan/heat sink assembly from side to side to detach the assembly.
NOTE: The thermal paste and thermal pads should be thoroughly cleaned from the surfaces of
the fan/heat sink assembly (1), (2), and (3), the system board components (4) and (6), and the
processor (5) each time the fan/heat sink assembly is removed. Thermal pads and thermal paste
should be applied to all surfaces before the fan/heat sink assembly is reinstalled. Thermal pads
and thermal paste are included with all fan/heat sink assembly, system board, and processor spare
part kits.
Reverse this procedure to install the fan/heat sink assembly.
58 Chapter 5 Removal and replacement procedures