HP (Hewlett-Packard) 2000 Laptop User Manual


 
NOTE: The following illustration shows the fan/heat sink assembly removal process on a computer
model equipped with an Intel processor, the Intel HM45 chipset, and a graphics subsystem with
UMA memory.
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with
the base enclosure, fan/heat sink assembly, processor, and system board spare part kits.
Replacement thermal material is also available in the Thermal Material Kit, spare part numbers
650277-001 (for use only with computer models equipped with an AMD processor) and 646135-001
(for use only with computer models equipped with an Intel processor).
NOTE: The following illustration shows the replacement thermal material locations on a computer
model equipped with an AMD processor.
Component replacement procedures 77