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Mobile Intel
®
915GME Express Chipset
April 2007 Development Kit User’s Manual
Order Number: 317230-001US 51
Heat Sink Installation Instructions—Mobile Intel
®
915GME Express Chipset
Appendix A Heat Sink Installation Instructions
It is necessary for the Mobile Intel
®
915GME Express Chipset to have a thermal
solution attached to the processor in order to keep the processor within its operating
temperature.
A heat sink is included in the kit. To install the heat sink:
1. Remove heat sink from its package and separate the fan sink portion from the heat
sink back plate.
2. Examine the base of the heat sink, where contact with the processor die is made.
There is a white Thermal Interface Material (TIM) on the surface. Do not add any
additional TIMs on top of this white material.
3. Place the back plate on the underside of the board so that the pins protrude
through the holes in the system board around the processor.
Figure 6. Heat Sink and Back Plate