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Reference Thermal Solution
R
22 Intel
®
955X Express Chipset Thermal/Mechanical Design Guide
Figure 6-5. Plastic Wave Soldering Heatsink Assembly
6.5.1 Heatsink Orientation
To enhance the efficiency of the reference thermal solution, it is important for the designer to
orient the fins properly with respect to the mean airflow direction. Simulation and experimental
evidence have shown that the MCH heatsink thermal performance is enhanced when the fins are
aligned with the mean airflow direction (see Figure 6-3).
6.5.2 Extruded Heatsink Profiles
The reference thermal solution uses an extruded heatsink for cooling the MCH. Figure 6-5 shows
the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other heatsinks with
similar dimensions and increased thermal performance may be available. Full mechanical drawing
of this heatsink is provided in Appendix B.