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Intel® Solid-State Drive 530 Series (M.2)
September 2013 Product Specification
Order Number: 329213-002US 1
Intel
®
Solid-State Drive 530 Series (M.2)
Product Specification
Capacities: 80 GB, 120 GB, 180 GB, 360 GB
Components:
− Intel
®
20 nm NAND Flash Memory
− Multi-Level Cell (MLC)
Form Factors: M.2 80 mm (single- and double-
sided)
− 2280-S2-B-M (80 GB and 180 GB)
− 2280-D2-B-M (120 GB and 360 GB)
Thickness: up to 3.58 mm
Weight: < 10 grams
SATA 6 Gb/s Bandwidth Performance
1
(Iometer* Queue Depth 32)
− Sustained Sequential Read: up to 540 MB/s
− Sustained Sequential Write: up to 490
MB/s
Read and Write IOPS
1
(Iometer Queue Depth 32)
− Random 4 KB Reads: up to 41,000 IOPS
− Random 4 KB Writes: up to 80,000 IOPS
2
Data Compression
AES 256-bit Encryption
End-to-End Data Protection
Compatibility
− Intel
®
SSD Toolbox with Intel
®
SSD
Optimizer
− Intel
®
Data Migration Software
− Intel
®
Rapid Storage Technology
− SATA Revision 3.0
− ACS-2 (ATA/ATAPI Command Set 2)
− SSD Enhanced SMART ATA feature set
Power Management
− 3.3 V SATA Supply Rail
− SATA Link Power Management (LPM)
− Device Sleep (DevSleep)
Power
− Active (BAPCo MobileMark* 2007
Workload): 140 mW
− Idle
3
: 55 mW
− DevSleep: 200 µW
Temperature
− Operating
4
: 0
o
C to 70
o
C
− Non-Operating: -55
o
C to 95
o
C
Reliability
— Uncorrectable Bit Error Rate (UBER):
<1 sector per 10
16
bits read
— Mean Time Between Failure (MTBF):
1,200,000 hours
— Shock (operating and non-operating):
1,000 G/0.5 msec
Vibration
— Operating: 2.17 G
RMS
(5-700 Hz)
— Non-operating: 3.13 G
RMS
(5-800 Hz)
Certifications and Declarations:
− UL*
− CE*
− C-Tick*
− BSMI*
− KCC*
− Microsoft* WHCK
− VCCI*
− SATA-IO*
Product Ecological Compliance
− RoHS*
NOTES:
1. Performance values vary by capacity.
2. Random 4 KB writes measured using out-of-box SSD.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the
system for maintaining proper device operating temperatures on heavier workloads.