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Intel® SHG2 DP Server Board Technical Product Specification General Specifications
Revision 1.0 Intel Order Number C11343-001
73
9.2 Airflow Specification for CIOB-X2 and CMIC-LE
The maximum thermal specifications for components listed require installation of a heat sink or
maintenance of a minimum level of airflow. Failure to maintain sufficient cooling airflow will
result in components exceeding maximum case temperature. Table 61 lists several chipset
components and their required airflow.
Table 61. Airflow Specification for Key Components
Component Maximum Power T
ja
at 1 M/sec
Airflow
T
jc
T
j
(Max)
CIOB-X2 7.0 W 28 C/W 0.4 C/W 100 C
CMIC-LE 10 W 5 C/W 0.2 C/W 100 C
9.3 Electrical Specifications
DC and AC specifications for the SHG2 server board are summarized here.
9.3.1 Power Consumption
Table 62 shows the power consumed on each supply line for a SHG2 baseboard configured
with two processors, each a 65W maximum, and 2 DIMMs stacked burst with 4 DIMMs in
standby at 70% maximum.
Note: The following numbers are provided as an example. Actual power consumption will vary
depending on the exact SHG2 configuration.
Table 62. SHG2 Power Budget
Description # Items 3.3v 5v 12v -12v 5v stby 3.3v stb
y
Peripheral Bay 2 0.7 0.7
Hard Drives 5 4.7 5.6
Add-In Slots 3 6.1 2.0
Cooling 6 2.5
Processors 4 12.7
Server board (Misc.) 1 1.5 2.7
Quick Server board Spec 1 3.8 5.1 1.4 0.2 1.5
Total Power (Amps) 9.8 14.0 25.5 0.2 1.5
Total Power (Watts) 32.4 69.8 306.2 2.4 7.7
Total
Watts 418
For your system or configured calculations, please add the power consumed by all devices
plugged into the server board.