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Chapter 1 17
Bluetooth
Item Specification
Chipset • Foxconn Bluetooth BRM 2046 BT2.1 (T60H928.33) f/w:861
• Foxconn Bluetooth ATH AR3011
• Foxconn Bluetooth BRM 2070 (T77H114.01)
• Foxconn Bluetooth BRM 2046 BT3.0 (T60H928.33) f/w:861
• Foxconn Bluetooth ATH AR3011 (BT3.0)
• Foxconn Bluetooth BRM 2070 (T77H114.01) BT 3.0
Data throughput Up to 24 Mbps
Protocol Bluetooth 2.1
Interface USB 2.0
Connector type USB
System Memory
Item Specification
Memory controller Built-in
Vendor & model name Elpida
• SO-DIMM DDRIII 1066 1GB EBJ10UE8BDS0-AE-F LF 128*8 0.065um
• SO-DIMM DDRIII 1333 1GB EBJ10UE8BDS0-DJ-F LF 128*8 0.065um
• SO-DIMM DDRIII 1066 2GB EBJ21UE8BDS0-AE-F LF 128*8 0.065um
• SO-DIMM DDRIII 1333 2GB EBJ21UE8BDS0-DJ-F LF 128*8 0.065um
• SO-DIMM DDRIII 1333 4GB EBJ41UF8BAS0-DJ-F LF 256*8 0.055um
Hynix
• SO-DIMM DDRIII 1333 1GB HMT112S6TFR8C-H9 LF 128*8 0.055u
• SO-DIMM DDRIII 1333 2GB HMT125S6TFR8C-H9 LF 128*8 0.055um
Kingston
•
Micron
• SO-DIMM DDRIII 1066 1GB MT8JSF12864HZ-1G1F1 LF 128*8 0.065um
• SO-DIMM DDRIII 1066 2GB MT16JSF25664HZ-1G1F1 LF 128*8 0.065um
Nanya
• SO-DIMM DDRIII 1333 2GB NT2GC64B8HC0NS-CG LF 128*8 0.065um
Samsung
• SO-DIMM DDRIII 1066 1GB M471B2873EH1-CF8 LF 64*16 0.055um
• SO-DIMM DDRIII 1333 1GB M471B2873FHS-CH9 LF 128*8 46nm
• SO-DIMM DDRIII 1066 2GB M471B5673EH1-CF8 LF 128*8 0.055um
• SO-DIMM DDRIII 1333 2GB M471B5673FH0-CH9 LF 128*8 46nm
• SO-DIMM DDRIII 1333 4GB M471B5273CH0-CH9 LF 256*8 46nm
Memory size 0 MB (no on-board memory)
SO-DIMM socket number 2 sockets
Supports memory size per
socket
4 GB
Supports maximum memory
size
8 GB
Supports SO-DIMM type DDR3 synchronous DRAM
Supports DIMM Speed 1066/1333 MT/s
Supports SO-DIMM package 204-pin SO-DIMM
Memory module combinations You can install memory modules in any combinations as long as they match the above
specifications.