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Chapter 1 19
Wireless Module
LAN Module
Bluetooth
Item Specification
Manufacturer
• Intel® WiFi Link 1000
Specifications
• IEEE 802.11b/g and Draft-N1 compliant
• Advanced security via 802.11i
• Industry-leading power consumption
• Includes Wi-Fi PAN – Intel® My WiFi Technology
• Easy to use Intel® PROSet v12.5 WLAN Software
• Advanced IT capabilities with Intel® PROSet
Software4
• Support for Cisco Compatible Extensions* v4
• Connect with Intel® Centrino® program eligible
Item Specification
Chipset
• Atheros AR8151L GbE LAN Controller with Integrated
Transceiver
Specifications
• Integrated PHY for 10/100/1000 Mbps
• Supports automatic MDI/MDIX functions
• PCI Express base 1.1 compliant
• Wake on LAN support
• 256 byte memory (using eFuse) embedded on
chip
• Supports up to 25% over-clocking without
requiring BIOS support
• Supports Energy Star 5.0
• Small footprint 40-pin QFN (5 x 5 mm) package
with dramatically improved
thermal and electrical
characteristics over LQFP packaging
Item Specification
Chipset
T60H928.33 miniUSB module
Features • Bluetooth 1.2 qualified Embedded USB Module
• Bluetooth 2.1 available in the 2.4GHz (ISM) band -
supports Enhanced Data Rate (EDR)
• USB 2.0 full-speed compliant interface
• Support Enhanced data rate (EDR)
• Support for A2DP
Specifications
• Radio Technology FHSS
• Operating Frequency 2.402GHz ~ 2.480GHz
• Channel Numbers 79 channels with 1MHz BW
• Transmitter Output Power -6~4dBm output power for
BT class 2 operation
• Coverage 10m (Varies depending on operating
environment)
• Receiver Sensitivity -75dBm, BER<0.1%
• Maximum Receiver Signal -10dBm
• Interface USB2.0 with 8 pin narrow pitch connector