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CHAPTER 6: FRU (Field-Replaceable Unit) list
144
Processor CPU Intel Core i3 330M PGA 2.13G 35W Arrandale, TJ90, VT, 3M L3 KC.33001.DMP
CPU Intel Core i3 350M PGA 2.26G 35W Arrandale, TJ90, VT, 3M L3 KC.35001.DMP
CPU Intel Core i5 430M PGA 2.26G ARD, up to SC 2.53G, 3M L3 KC.43001.DMP
CPU Intel Core i5 520M 2.4G 3M KC.52001.DMP
CPU Intel Core i5 540M 2.53G 3M KC.54001.DMP
CPU Intel Core i7 620M PGA 2.66G 4M KC.62001.DMP
Memory Memory ELPIDA SO-DIMM DDRIII 1066 1GB EBJ10UE8BDS0-AE-F LF 128*8
0.065um
KN.1GB09.012
Memory HYNIX SO-DIMM DDRIII 1066 1GB HMT112S6BFR6C-G7 N0 LF
64*16 0.055um
KN.1GB0G.025
Memory MICRON SO-DIMM DDRIII 1066 1GB MT8JSF12864HZ-1G1F1 LF
128*8 0.065um
KN.1GB04.015
Memory SAMSUNG SO-DIMM DDRIII 1066 1GB M471B2873EH1-CF8 LF
64*16 0.055um
KN.1GB0B.028
Memory ELPIDA SO-DIMM DDRIII 1066 2GB EBJ21UE8BDS0-AE-F LF 128*8
0.065um
KN.2GB09.006
Memory HYNIX SO-DIMM DDRIII 1066 2GB HMT125S6BFR8C-G7 N0 LF
128*8 0.055um
KN.2GB0G.014
Memory MICRON SO-DIMM DDRIII 1066 2GB MT16JSF25664HZ-1G1F1 LF
128*8 0.065um
KN.2GB04.015
Memory SAMSUNG SO-DIMM DDRIII 1066 2GB M471B5673EH1-CF8 LF
128*8 0.055um
KN.2GB0B.012
Memory NONE SO-DIMM DDRIII 1066 4GB dummy P/N LF KN.4GB00.001
Memory ELPIDA SO-DIMM DDRIII 1333 4GB EBJ41UF8BAS0-DJ-F LF 256*8
0.055um
KN.4GB09.001
VGA chip AMD MADISON_PRO 40nm 29mm*29mm M2 package KI.23200.169
AMD PARK_XT 40nm 29mm*29mm M2 package KI.23200.162
UMA (Intel) KI.23200.038
NVIDIA N11MGE1 40nm 29mm*29mm GB1-128 package KI.23200.160
VRAM VRAM SAMSUNG Graphic DDRIII 800 1Gb K4W1G1646E-HC12 LF VR.1GB0B.006
VRAM HYNIX Graphic DDRIII 800 1Gb H5TQ1G63BFR-12C LF VR.1GB0G.004
1G-DDR3 64*16*8 KI.23300.018
512M-DDR3 64*16*4 KI.23300.019
VRAM ATI Graphic DDRIII 800 1Gb 23EY2387MA12-SZ LF+HF VR.1GB0T.002
Core logic NB Chipset Intel CS BD82HM55 KI.G5501.002
LAN chipset Broadcom BCM57780 NI.22400.047
Audio codec Realtek Audio Codec ALC272X LZ.21000.045
WLAN module Foxconn Wireless LAN Atheros HB93 2x2 BGN (HM) NI.23600.062
Liteon Wireless LAN Atheris HB93 2x2 BGN (HM) WN6602AH NI.23600.063