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10
INTERCONNECT
SOLUTIONS
Samtec makes one of the widest selections of high speed,
high reliability, board to board interconnects.
Samtec’s Q-Series
®
offers the popular Q-Strip
®
single-ended
and Q-Pairs® differential interconnects for high speed, controlled
impedance applications. Their design minimises impedance
mismatch and crosstalk and optimises capacitance and inductance.
Q-Strip and Q-Pairs are available in 0.5mm pitch (QTH, QSH),
0.635mm (QTS, QSS) and 0.8mm pitch (QTE, QSE). The 9.5A rated,
integral ground/power plane has SMT leads to save board space.
The 0.8mm pitch Q-Pairs carry <8.5GHz per pair rating at -3dB
insertion loss.
Second generation, Q2™ high speed interconnects suit rugged
applications thanks to greater insertion depth, optional retention
pins that almost double the unmating force, guideposts and
optional locking screws/holes. All Q2 products offer optional EMI
shielding, power pins rated up to 3A per pin and MMCX scale RF
connectors.
The ERM8 and ERF8 interconnects use the Edge Rate contact
system for smaller pitch and high speed, reduced broadside
coupling and capacitance. Rated at 10.5GHz, the system is rugged,
handles more mating cycles than other high-speed systems and
can be zippered for mating and unmating. They are available in
7mm, 9mm, 10mm, 12mm, 14mm, and 16mm stack heights with
<150 pins on a 0.8mm centreline.
High-density array configurations provide high speed, controlled
impedance, board to board interfaces with much higher pin counts
than traditional strip connectors, increasing board routing flexibility
and grounds. The extra pins available for grounding reduce
crosstalk, allowing elevated board stacking.
Several footprints, stack heights and contact designs are available
to meet a variety of applications. SEARAY
®
, and HD Mezz* for
elevated board stacking, are 1.27 x 1.27 open-pin field arrays that
can map as single-ended configurations in differential pairs or a
combination. SEARAY and HD Mezz are available from Samtec and
Molex. DPArray
®
has a staggered pin design; perimeter ground
pins reduce the number of grounds needed, providing easier board
routing, fewer board layers and more differential pairs per square
inch.
Samtec offers Data Rate cable systems for flexibility and high
speed. At 31cm length, in single-ended configurations, Data
Rate cable assemblies are rated at 2.57GHz (EQCD series) and
1.87GHz (HQCD) at -3dB insertion loss. Maximum performance
of these cable assemblies can be higher. These cable assemblies
are preferable when an application requires low crosstalk, low
EMI emission and susceptibility, higher frequency, less loss or
lower voltage drop. They are ideal when mechanical routings are
challenging, for high flex and crush life; they suit applications from
200mm to 3m.
* HD Mezz is a trademark of Molex Incorporated
Features
U Q-Strip and Q-Pairs
- 0.5mm pitch (QTH, QSH)
- 0.635mm (QTS, QSS)
- 0.8mm pitch (QTE, QSE)
- 9.5A rated, integral ground/power plane
- <8.5GHz rating for 0.8mm pitch Q-Pairs
U ERM8 and ERF8 Edge Rate interconnects
- Micro pitch and rugged
- Reduced broadside coupling and capacitance
- Rated at 10.5GHz/pin
- Zipper mating and unmating
- Stack heights 7mm, 9mm, 10mm, 12mm, 14mm and
16mm <150 pins, 0.8mm centreline
U High-density arrays
- Controlled impedance, board to board interface
- Higher pin counts increase routing flexibility and grounds
- Extra pins for grounding reduce crosstalk, allow elevated
board stacking
- HD Mezz stack heights: 20mm, 25mm, 30mm, 35mm
U Data Rate cable assembly
- Rated at 2.57GHz EQCD; 1.87GHz HQCD
U Final Inch
®
free tool available: provides optimised interconnect
PCB breakout region
Applications
U Medical equipment
U Industrial applications
U Telecommunications
Wide selection of board to board and cable assemblies
High Speed, High Reliability Interconnects
ENQUIRY 1444
Samtec
TLS Guide
available!