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H61M-K specications summary
CPU LGA1155 socket for Intel
®
3rd/2nd Generation Core™ i7, Core™ i5, Core™
i3, Pentium
®
, and Celeron
®
processors
Supports Intel
®
22nm/32nm CPU
Supports Intel
®
Turbo Boost Technology 2.0
• Up to 77W Thermal Design Power support.
• The Intel
®
Turbo Boost Technology 2.0 support depends on the CPU
types.
• Refer to www.asus.com for Intel
®
CPU support list.
Chipset Intel
®
H61 Express Chipset
Memory 2 x DIMMs, max. 16GB, DDR3 1600 / 1333 / 1066 MHz, non-ECC, un-
buffered memory
Dual-channel memory architecture
• Refer to www.asus.com for the latest Memory QVL (Qualied Vendors
List).
• When you install a total memory of 4GB capacity or more, Windows
®
32-bit operating system may only recognize less than 3GB. We
recommend a maximum of 3GB system memory if you are using a
Windows
®
32-bit operating system.
Expansion slots 1 x PCI Express 3.0*/2.0 x16 slot
2 x PCI Express 2.0 x1 slots
• PCIe 3.0 speed is supported by Intel
®
3rd generation Core™
processors.
VGA Output DVI-D with Max. Resolution: 1920x1200@60Hz
D-SUB with Max. Resolution: 2048x1536@75Hz
Max. UMA Memory: 1024MB
Storage
Intel
®
H61 Express Chipset:
- 4 x Serial ATA 3 Gb/s connectors
LAN
Realtek
®
8111F PCIe Gigabit LAN controller
Audio Realtek
®
ALC887 8-channel High Denition Audio CODEC
• Use a chassis with HD audio module in the front panel to support an
8-channel audio output.
USB Intel
®
H61 Express Chipset:
- 8 x USB 2.0/1.1 ports (4 ports at the mid-board, 4 ports at the back
panel)