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Document #: 001-08029 Rev. *E Page 10 of 13
CY62138FV30 MoBL
®
Figure 3. 32-pin (450 Mil) Molded SOIC, 51-85081
Package Diagrams (continued)
0.546[13.868]
0.440[11.176]
0.101[2.565]
0.050[1.270]
0.014[0.355]
0.118[2.997]
0.004[0.102]
0.047[1.193]
0.006[0.152]
0.023[0.584]
0.793[20.142]
0.450[11.430]
0.566[14.376]
0.111[2.819]
0.817[20.751]
BSC.
0.020[0.508]
MIN.
MAX.
0.012[0.304]
0.039[0.990]
0.063[1.600]
SEATINGPLANE
116
17 32
0.004[0.102]
51-85081-*B
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