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CY62157E MoBL
®
Document #: 38-05695 Rev. *C Page 4 of 12
Thermal Resistance
[9]
Parameter Description Test Conditions TSOP II VFBGA Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
77 72 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
13 8.86 °C/W
AC Test Loads and Waveforms
Parameters Values Unit
R1 1800 Ω
R2 990 Ω
R
TH
639 Ω
V
TH
1.77 V
Data Retention Characteristics (Over the Operating Range)
Parameter Description Conditions Min Typ
[4]
Max Unit
V
DR
V
CC
for Data Retention 2 V
I
CCDR
Data Retention Current
V
CC
=2V, CE
1
> V
CC
– 0.2V,
CE
2
< 0.2V, V
IN
> V
CC
– 0.2V or V
IN
< 0.2V
Industrial 8 µA
Automotive 30
t
CDR
[9]
Chip Deselect to Data
Retention Time
0ns
t
R
[10]
Operation Recovery Time t
RC
ns
Data Retention Waveform
[11]
Notes:
10.Full device operation requires linear V
CC
ramp from V
DR
to V
CC(min)
> 100 µs or stable at V
CC(min)
> 100 µs.
11. BHE
.BLE is the AND of both BHE and BLE. Chip can be deselected by either disabling the chip enable signals or by disabling both BHE and BLE.
3V
V
CC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns
Fall Time = 1 V/ns
OUTPUT V
Equivalent to: THEVENIN EQUIVALENT
ALL INPUT PULSES
R
TH
R1
V
CC(min)
t
CDR
V
DR
> 2 V
DATA RETENTION MODE
t
R
V
CC
CE
1
or
BHE
.BLE
CE
2
V
CC(min)
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