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CY7C1316JV18, CY7C1916JV18
CY7C1318JV18, CY7C1320JV18
Document Number: 001-15271 Rev. *B Page 25 of 26
Package Diagram
Figure 4. 165-ball FBGA (13 x 15 x 1.40 mm), 51-85180
A
1
PIN1CORNER
15.00±0.10
13.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25MCAB
Ø0.05MC
B
A
0.15(4X)
0.35±0.06
SEATINGPLANE
0.53±0.05
0.25C
0.15C
PIN1CORNER
TOPVIEW
BOTTOMVIEW
2345678910
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
1110986754321
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
15.00±0.10
13.00±0.10
B
C
1.00
5.00
0.36
-0.06
+0.14
1.40MAX.
SOLDERPADTYPE:NON-SOLDERMASKDEFINED(NSMD)
NOTES:
PACKAGEWEIGHT:0.475g
JEDECREFERENCE:MO-216/DESIGN4.6C
PACKAGECODE:BB0AC
51-85180-*A
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