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CY7C1338G
Document #: 38-05521 Rev. *D Page 9 of 17
Capacitance
[10]
Parameter Description Test Conditions
100 TQFP
Max.
119 BGA
Max. Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
DD
= 3.3V.
V
DDQ
= 3.3V
55pF
C
CLK
Clock Input Capacitance 5 5 pF
C
I/O
Input/Output Capacitance 5 7 pF
Thermal Resistance
[10]
Parameter Description Test Conditions
100 TQFP
Package
119 BGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Test conditions follow standard test
methods and procedures for
measuring thermal impedance, per
EIA/JESD51.
30.32 34.1 °C/W
ΘJC Thermal Resistance
(Junction to Case)
6.85 14.0 °C/W
AC Test Loads and Waveforms
Note:
10.Tested initially and after any design or process change that may affect these parameters.
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
R
L
= 50Ω
Z
0
= 50Ω
V
T
= 1.5V
3.3V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
OUTPUT
R = 1667Ω
R =1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
R
L
= 50Ω
Z
0
= 50Ω
V
T
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1ns
≤ 1ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load