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CY7C1460AV33
CY7C1462AV33
CY7C1464AV33
Document #: 38-05353 Rev. *D Page 27 of 27
Document History Page
Document Title: CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM
with NoBL™ Architecture
Document Number: 38-05353
REV. ECN No. Issue Date
Orig. of
Change Description of Change
** 254911 See ECN SYT New Data sheet
Part number changed from previous revision. New and old part number differ
by the letter “A”
*A 303533 See ECN SYT Changed H9 pin from V
SSQ
to V
SS
on the Pin Configuration table for 209
FBGA on Page # 5
Changed the test condition from V
DD
= Min to V
DD
= Max for V
OL
in the
Electrical Characteristics table
Replaced Θ
JA
and Θ
JC
from TBD to respective Thermal Values for All
Packages on the Thermal Resistance Table
Changed I
DD
from 450, 400 & 350 mA to 475, 425 & 375 mA for 250, 200
and 167 MHz respectively
Changed I
SB1
from 190, 180 and 170 mA to 225 mA for 250, 200 and 167
MHz respectively
Changed I
SB2
from 80 mA to 100 mA for all frequencies
Changed I
SB3
from 180, 170 & 160 mA to 200 mA for 250, 200 and 167 MHz
respectively
Changed I
SB4
from 100 mA to 110 mA for all frequencies
Changed C
IN
, C
CLK
and C
I/O
to 6.5, 3 and 5.5 pF from 5, 5 and 7 pF for TQFP
Package
Changed t
CO
from 3.0 to 3.2 ns and t
DOH
from 1.3 ns to 1.5 ns for 200 MHz
Speed Bin
Added lead-free information for 100-pin TQFP and 165 FBGA and 209 BGA
packages
*B 331778 See ECN SYT Modified Address Expansion balls in the pinouts for 165 FBGA and 209 BGA
Package as per JEDEC standards and updated the Pin Definitions accord-
ingly
Modified V
OL,
V
OH
test conditions
Changed C
IN
, C
CLK
and C
I/O
to 7, 7and 6 pF from 5, 5 and 7 pF for 165 FBGA
Package
Added Industrial Temperature Grade
Changed I
SB2
and I
SB4
from 100 and 110 mA to 120 and 135 mA respectively
Updated the Ordering Information by Shading and Unshading MPNs as per
availability
*C 417509 See ECN RXU Converted from Preliminary to Final
Changed address of Cypress Semiconductor Corporation on Page# 1 from
“3901 North First Street” to “198 Champion Court”
Changed I
X
current value in MODE from –5 & 30 µA to –30 & 5 µA respec-
tively and also Changed I
X
current value in ZZ from –30 & 5 µA to –5 & 30
µA respectively on page# 18
Modified test condition from V
IH
< V
DD
to
V
IH
< V
DD
Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the
Electrical Characteristics Table
Replaced Package Name column with Package Diagram in the Ordering
Information table
Replaced Package Diagram of 51-85050 from *A to *B
*D 473229 See ECN NXR Added the Maximum Rating for Supply Voltage on V
DDQ
Relative to GND
Changed t
TH
, t
TL
from 25 ns to 20 ns and t
TDOV
from 5 ns to 10 ns in TAP
AC Switching Characteristics table
Updated the Ordering Information table.
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