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CY7C1510KV18, CY7C1525KV18
CY7C1512KV18, CY7C1514KV18
Document Number: 001-00436 Rev. *E Page 29 of 30
Package Diagram
Figure 6. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180
A
1
PIN1 CORNER
15.00±0.10
13.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25MCAB
Ø0.05M C
B
A
0.15(4X)
0.35±0.06
SEATINGPLANE
0.53±0.05
0.25C
0.15C
PIN1 CORNER
TOPVIEW
BOTTOMVIEW
2345678910
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
1110986754321
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
15.00±0.10
13.00±0.10
B
C
1.00
5.00
0.36
-0.06
+0.14
1.40MAX.
SOLDER PAD TYPE: NON-SOLDER MASK DEFINED (NSMD)
NOTES :
PACKAGE WEIGHT :0.475g
JEDEC REFERENCE :MO-216 / DESIGN 4.6C
PACKAGE CODE :BB0AC
51-85180-*A
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