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CY8C21634, CY8C21534
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Document Number: 38-12025 Rev. *O Page 38 of 45
Figure 28. 56-Pin (300-Mil) SSOP
Thermal Impedances
51-85062 *C
Table 40. Thermal Impedances per Package
Package Typical θ
JA
[22]
Typical θ
JC
16 SOIC 123
o
C/W 55
o
C/W
20 SSOP 117
o
C/W 41
o
C/W
28 SSOP 96
o
C/W 39
o
C/W
32 QFN
[23]
5x5 mm 0.60 MAX 27
o
C/W 15
o
C/W
32 QFN
[23]
5x5 mm 0.93 MAX 22
o
C/W 12
o
C/W
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