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STK11C88
Document Number: 001-50591 Rev. ** Page 13 of 15
Package Diagrams
Figure 11. 28-Pin (300 mil) SOIC (51-85026)
51 85127 *A
PIN1ID
0.291[7.39]
0.300[7.62]
0.394[10.01]
0.419[10.64]
0.050[1.27]
TYP.
0.092[2.33]
0.105[2.67]
0.004[0.10]
0.0118[0.30]
SEATINGPLANE
0.0091[0.23]
0.0125[3.17]
0.015[0.38]
0.050[1.27]
0.013[0.33]
0.019[0.48]
0.026[0.66]
0.032[0.81]
0.697[17.70]
0.713[18.11]
0.004[0.10]
114
15 28
*
*
*
PART#
S28.3 STANDARDPKG.
SZ28.3LEADFREEPKG.
MIN.
MAX.
NOTE:
1.JEDECSTDREFMO-119
2.BODYLENGTHDIMENSIONDOESNOTINCLUDEMOLDPROTRUSION/ENDFLASH,BUT
MOLDPROTRUSION/ENDFLASHSHALLNOTEXCEED0.010in(0.254mm)PERSIDE
3.DIMENSIONSININCHES
4.PACKAGEWEIGHT0.85gms
DOESINCLUDEMOLDMISMATCHANDAREMEASUREDATTHEMOLDPARTINGLINE.
51-85026-*D
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