Fujitsu FTR-G1 Power Supply User Manual


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5
FTR-G1 SERIES
1. General Information
l Relaysproducedafterthespecicdatecodethatisindicatedoneachdatasheetarelead-free
now. All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)
l Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu.
l All signal and power relays also comply with RoHS. Please refer to individual data
sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that
are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).
l
Ithasbeenveriedthatusinglead-freerelaysinleadedassemblyprocesswillnotcauseany
problems (compatible).
l “LF” is marked on each outer and inner carton. (No marking on individual relays).
l Toavoidleadedrelays(forlead-freesample,etc.)pleaseconsultwithareasalesofce.
l We will ship leaded relays as long as the leaded relay inventory exists.
Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)
2. Recommended Lead Free Solder Prole
l Recommended solder paste Sn-3.0Ag-0.5Cu.
RoHS Compliance and Lead Free Relay Information
3. Moisture Sensitivity
l Moisture Sensitivity Level standard is not applicable to electromechanical realys.
4. Tin Whisker
l Dipped SnAgCu solder is known as low risk tin whisker. No considerable length whisker was found by our in
house test.
We highly recommend that you conrm your actual solder conditions
Flow Solder condition:
Pre-heating: maximum120˚C
Soldering: dip within 5 sec. at
260˚Csolerbath
Solder by Soldering Iron:
Soldering Iron
Temperature: maximum360˚C
Duration: maximum 3 sec.
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