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4. Remove the fan/heat sink assembly (3).
NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it may be necessary to move the fan/heat sink assembly
from side to side to detach it from the system board.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed: Thermal paste is
used on the processor (1) and the fan/heat sink assembly section (2) that services it.
Reverse this procedure to install the fan/heat sink assembly.
68 Chapter 4 Removal and replacement procedures