HP (Hewlett-Packard) 335167-003 Laptop User Manual


 
iv Maintenance and Service Guide
Contents
3.5 Miscellaneous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–10
3.6 Sequential Part Number Listing . . . . . . . . . . . . . . . 3–11
4 Removal and Replacement Preliminaries
4.1 Tools Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
4.2 Service Considerations . . . . . . . . . . . . . . . . . . . . . . . 4–2
Plastic Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2
Cables and Connectors. . . . . . . . . . . . . . . . . . . . . . . 4–2
4.3 Preventing Damage to Removable Drives . . . . . . . . 4–3
4.4 Preventing Electrostatic Damage . . . . . . . . . . . . . . . 4–4
4.5 Packaging and Transporting Precautions . . . . . . . . . 4–4
4.6 Workstation Precautions . . . . . . . . . . . . . . . . . . . . . . 4–5
4.7 Grounding Equipment and Methods . . . . . . . . . . . . . 4–6
5 Removal and Replacement Procedures
5.1 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2
5.2 Disassembly Sequence Chart . . . . . . . . . . . . . . . . . . 5–3
5.3 Preparing the Notebook for Disassembly . . . . . . . . . 5–5
5.4 Notebook Feet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11
5.5 Mini PCI Communications Board. . . . . . . . . . . . . . 5–12
5.6 MultiBay Device . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–16
5.7 Bluetooth Wireless Communications Board. . . . . . 5–17
5.8 Integrated Smart Card . . . . . . . . . . . . . . . . . . . . . . . 5–19
5.9 Keyboard. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–21
5.10 Modem Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–24
5.11 Memory Expansion Board . . . . . . . . . . . . . . . . . . 5–25
5.12 Switch Cover. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–27
5.13 Keyboard Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–29
5.14 Security Module (TPM) . . . . . . . . . . . . . . . . . . . . 5–30
5.15 Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–31
5.16 Heat Sink. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–34
5.17 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–37
5.18 Display Assembly . . . . . . . . . . . . . . . . . . . . . . . . . 5–39
5.19 Top Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–43