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EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Automatic crossing screw driver Philip #1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the Battery,and loosen screws on logic lower.
2. Get HDD, ODD and memory.
3. Remove KB,Pull out connecter.
4. Remove C cover
5. Pull out the DC IN cable, HDD connecter,ODD connecter,and USB Board cable,Remove Speaker cable from MB.
6. Loosen screw on WLAN and remove antenna.
7. Remove the MB,take down the thermal module and the CPU.
8. Remove LCD module, tear down LCD Cover.
9. Remove panel and camera
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).