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3.
Loosen the four captive screws (2) and the three captive screws (3) that secure the heat sink to
the system board.
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
system board components, it may be necessary to move the heat sink from side to side to
detach it.
4. Remove the fan and heat sink (4).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the base enclosure, heat sink, processor, and system board spare part kits.
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it (only on computer models equipped with a graphics subsystem with switchable
discrete memory)
ENWW
Component replacement procedures
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