Intel BOXDH55HC Computer Hardware User Manual


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Europe
(Low Voltage Directive 2006/95/EC)
EN 60950-1
International
IEC 60950-1
EMC regulations (tested in representative chassis)
United States
FCC 47 CFR Part 15, Subpart B
Canada
ICES-003 Class B
Europe
(EMC Directive 2004/108/EC)
EN 55022 and EN 55024
Australia/New Zealand
EN 55022 Class B
Japan
VCCI V-3, V-4 Class B
South Korea
KN-22 and KN-24
Taiwan
CNS 13438 Class B
International
CISPR 22 Class B
Environmental Compliance
Europe
Europe RoHS (Directive 2002/95/EC)
China
China RoHS (MII Order # 39)
For ordering information, visit
www.intel.com
For the most current product information,
visit www.intel.com/go/idb
or http://ark.intel.com
For specific processor compatibility, visit
http://processormatch.intel.com
PROCESSOR
Processor Support
•Intel®Core™i7,Intel®Core™i5,Intel®Core™i3,and
Intel®Pentium®processorsintheLGA1156package
•SupportsIntel®64architecture
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CHIPSET
Intel® H55 Express Chipset
•Intel®82H55PlatformControllerHub(PCH)
Peripheral Connectivity
•SixSATAports(3.0Gb/s)withtwoSATAports
compatiblewitheSATAdongle
•TwelveHi-SpeedUSB2.0ports(sixbackpanel
portsandsixadditionalportsviathreeinternal
headers)
System BIOS
•64MbFlashEEPROMwithIntel®Platform
InnovationFrameworkforEFIPlugandPlay
•Advancedconfigurationandpowerinterface
V3.0b,DMI2.5
•Intel®ExpressBIOSupdatesupport
Hardware Management Features
•Processorfanspeedcontrol
•Frontandrearsystemchassisfanspeedcontrol
•Voltageandtemperaturesensing
•Fansensorinputsusedtomonitorfanactivity
•ACPI-compliantpowermanagementsupport
Intel® PRO 10/100/1000 Network Connection
•Newlow-powerdesign
1
Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software, and overall
system conguration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. See www.intel.com/technology/turboboost for more information.
2
Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS, and operating system. Performance will vary
depending on the specic hardware and software you use. For more information including details on which processors support HT Technology, see www.intel.com/info/hyperthreading.
3
Requires a processor with Intel® HD Graphics.
4
System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much
as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system conguration and operating system.
5
Intel® High Denition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending
on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm.
6
WARNING: Altering PC memory frequency, voltage, and/or latency may: (i) reduce system stability and useful life of the system, memory, and processor; (ii) cause the processor and other system compo-
nents to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the
memory beyond its specications. Intel assumes no responsibility that the memory, including if used with altered clock frequencies and/or voltages, will be t for any particular purpose. Check with memory
manufacturer for warranty and additional details.
7
64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not
operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software congurations. See http://developer.intel.com/technology/
intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS
OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specications and product descriptions at any time, without notice.
All products, dates, and gures specied are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, Intel Core, and Pentium are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2010 Intel Corporation. All rights reserved. 0210/FZ/MS/PDF 322801-001US
Intel® Desktop Boards DH55HC and DH55TC Media Series Technical Specications
Expansion Capabilities
•OnePCIExpress*2.0x16connector
•TwoPCIExpress2.0x1connectors
•ThreePCIconnectors(DH55HC)
•OnePCIconnector(DH55TC)
Audio
•5.1+2multistreamingIntel®HighDefinitionAudio
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•InternalS/PDIFheaderandspeakerheaders
Video
•VGA+DVI-D+HDMI*
3
: supports dual independent
displayforIntel®Core™processorswithIntel®HD
Graphics
SYSTEM MEMORY
Memory Capacity
•Four240-pinDIMMconnectorssupportingupto
fourdouble-sidedDIMMs
•Maximumsystemmemoryupto16GB
4
using4GB
double-sided DIMMs
Memory Types
•DDR31333/1066SDRAMmemorysupport
•Non-ECCMemory
•Supportsmemoryovervoltage(DH55TC)and
memoryoverclocking
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Memory Modes
•Dual-orsingle-channeloperationsupport
Memory Voltage
•Memoryovervoltageto1.60Vand1.65V(DH55HC)
•1.5VstandardJEDECvoltage
JUMPERS AND FRONT-PANEL CONNECTORS
Jumpers
•JumperaccessforBIOSmaintenancemode
Front-Panel Connectors
•Reset,HDLED,PowerLEDs,poweron/off
•Front-panelaudioheader
Other Connectors
•Oneserialportheader
•Oneparallelportheader
•ChassisIntrusionDetectheader(DH55HC)
MECHANICAL
Form Factor
•ATX(DH55HC)
•MicroATX(DH55TC)
Board Size
•9.6”x11.6”(24.38cmx29.46cm)(DH55HC)
•9.6”x9.6”(24.38cmx24.38cm)(DH55TC)
Baseboard Power Requirements
•ATX12V
ENVIRONMENT
Operating Temperature
•0°Cto+40°C
Storage Temperature
•-40°Cto+60°C
REGULATIONS AND SAFETY STANDARDS
United States and Canada
CSA/UL60950-1,FirstEdition(BinationalStandard)
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