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Ordering Information: See the Intel Web site at www.intel.com
For the most current product information, visit developer.intel.com/design/motherbd/
For ENERGY STAR* recommended configurations, visit www.intel.com/go/energystar
1
System resources (such as PCI and PCI Express*) require physical memory address locations that reduce available memory addresses above 3 GB. This may result in less than 4 GB
of memory being available to the operating system and applications
.
2
64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture.
Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations.
See http://developer.intel.com/technology/intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING
TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Intel, the Intel logo, Intel. Leap ahead., the Intel. Leap ahead. logo, Intel Core, Pentium, and Celeron are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
** Supports 95W Thermal Design Power, Intel® Core™2 Quad Processors with 1066 MHz System Bus. For information, visit www.intel.com/go/findCPU
Copyright © 2007 Intel Corporation. All rights reserved. 0707/MS/VD/PDF 317696-001US
Technical Specifications
Processor
Processor Support
• Intel® Core™2 Quad** processor in the LGA775
package
• Intel® Core™2 Duo processor in the LGA775
package
• Intel® Pentium® Dual-Core processor in the
LGA775 package
• Intel® Celeron® 400 Sequence processor in the
LGA775 package
• Supports Intel® 64 Architecture
2
Chipset
Intel® G31 Express Chipset
• Intel® LE82G31 Graphics Memory Controller
Hub (GMCH)
• Intel® 82801GB I/O Controller Hub (ICH7)
• Serial Peripheral Interface (SPI) Flash
Graphics Memory Controller Hub (GMCH)
• Designed to support up to 4 Gb
1
of system
memory using DDR2 800 / 667 SDRAM
memory
• Intel® Fast Memory Access
• Intel® Graphics Media Accelerator X3100
Intel® I/O Controller Hub
• Ultra ATA 100/66 devices
• Four SATA (3.0 Gb/s) ports
• Integrated 10/100/1000 Network Connection
USB 2.0
Integrated Intel® ICH7 controllers:
• Four back-panel ports (two dual stack)
• Four additional ports (via two headers)
I/O Features
Integrated super I/O LPC bus controller
• Two PCI local bus slots
• One PCI Express* x1 local bus slot
System BIOS
• 8 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play,
IDE drive auto-configure
• Advanced configuration and power interface
V1.0b, DMI 2.0, multilingual support
System Memory
Memory Capacity
• Two 240-pin DIMM connectors supporting
up to two double-sided DIMMs
Memory Types
• DDR2 800 / 667 SDRAM memory support
• Non-ECC Memory
Memory Modes
• Dual or single-channel operation support
Memory Voltage
• 1.8V
Hardware Management Features
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• Power management support for ACPI 1.0b
Expansion Capabilities
• Two PCI bus add-in card connectors
• One PCI Express* x1 bus add-in card connector
• One PCI Express* x16 Graphics connector
Jumpers and Front-Panel Connectors
Jumpers
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
Front-Panel Connectors
• Reset, HD LED, Power LEDs, power on/off
• Two front-panel Hi-Speed USB 2.0 headers
• Front-panel audio header
• Front-panel serial header
Mechanical
Board Style
• ATX 2.2 compliant
Board Size
• 9.6” x 8.6” (24.38 cm x 21.84 cm)
Baseboard Power Requirements
• ATX12V
Environment
Operating Temperature
• 0° C to +55° C
Storage Temperature
• -40° C to +70° C
Regulations and Safety Standards
United States and Canada
CSA/UL 60950-1, First Edition
(Binational Standard)
Europe
(Low Voltage Directive 2006/95/EC)
EN 60950-1:2006
International
IEC 60950-1:2001, First Edition
EMC Regulations
(tested in representative chassis)
United States
FCC 47 CFR Part 15, Subpart B
Canada
ICES-003 Class B
Europe
(EMC Directive 2004/108/EC)
EN 55022:2006 and EN 55024:1998
Australia/New Zealand
EN 55022:2006 Class B
Japan
VCCI V-3/04.04, V-4/03.04, Class B
South Korea
KN-22:2005 and KN-24:2005
Taiwan
CNS 13438:2006 Class B
International
CISPR 22:2005 +A1:2005 +A2:2006 Class B
Environmental Compliance
Europe
Europe RoHS (Directive 2002/95/EC)
China
China RoHS (MII Order # 39)
Lead-Free: The symbol is used
to identify electrical and electronic
assemblies and components in which
the lead (Pb) concentration level in
any of the raw materials and the end product is
not greater than 0.1% by weight (1000 ppm). This
symbol is also used to indicate conformance to
lead-free requirements and definitions adopted
under the European Union’s Restriction on Haz-
ardous Substances (RoHS) directive, 2002/95/EC.