Intel DP55KG Computer Hardware User Manual


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Europe
Nemko certified to EN 60950 International
Nemko certified to IEC 60950
(CB report with CB certificate)
EMC regulations (tested in representative chassis)
United States
FCC Part 15, Class B
FCC Part 15, Class B open-chassis (cover off) testing
Canada
ICES-003, Class B
Europe
EMC directive 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/New Zealand
AS/NZS 3548, Class B
Taiwan
CNS 13438, Class B International
CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF via
EN55022 +6 db in system configurations with an
open chassis and EU Directive 89/336/EEC and use via
EN55022 and EN50082-1 in a representative chassis.
Lead-Free: The symbol is used to identify
electrical and electronic assemblies and com-
ponents in which the lead (Pb) concentration
level in any of the raw materials and the end product
is not greater than 0.1% by weight (1000 ppm). This
symbol is also used to indicate conformance to lead-
free requirements and definitions adopted under
the European Union’s Restriction on Hazardous
Substances (RoHS) directive, 2002/95/EC.
For ordering information, visit
www.intel.com
For the most current product information,
visit www.intel.com/go/idb
or http://ark.intel.com
For specific CPU compatibility, visit
http://processormatch.intel.com
PROCESSOR
Processor Support
•Intel®Core™i7andIntel®Core™i5processorsinthe
LGA1156 package
•Intel®TurboBoostTechnology
3
•Intel®Hyper-ThreadingTechnology
4
•IntegratedMemoryControllerwithsupportforup
to 16 GB
5
of system memory DDR3 1600+
1
/ 1333 /
1066 MHz SDRAM
•Intel®FastMemoryAccess
•SupportsIntel®64architecture
7
CHIPSET
New Intel® P55 Express Chipset
•Intel®82P55PlatformControllerHub(PCH)
•Intel®MatrixStorageTechnology(RAID0,1,5,10)
•EightonboardSATAports
•TwoeSATA(3.0Gb/s)portsonthebackpanel
provided by a Marvell* 88SE6145 controller
USB 2.0
Integrated Intel® PCH controller
•EightHi-SpeedUSB2.0portsviabackpanel
•Fouradditionalportsviatwointernalheaders
•Oneonboardportviainternalheader
System BIOS
•16MbFlashEEPROMwithIntel®PlatformInnovation
Framework for EFI Plug and Play, IDE drive auto-
configure
•Advancedconfigurationandpowerinterface
V3.0b, DMI 2.5
Intel® Rapid BIOS Boot
•Intel®RapidBIOSBoot
•Intel®ExpressBIOSupdatesupport:BIOSupdate
via new F7 function key
1
DDR3 1600 or higher memory support requires compatible Intel® XMP-enabled memory or advanced knowledge of BIOS and memory tuning; individual results may vary. Altering PC memory frequency and/or
voltage may (i) reduce system stability and use life of the system, memory and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv)
cause additional heat or other damage; and (v) affect system data integrity. Intel assumes no responsibility that the memory, included if used with altered clock frequencies and/or voltages, will be t for
any particular purpose. Check with memory manufacturer for warranty and additional details. For specic supported memory for this motherboard, please visit www.intel.com/go/idb for more details.
2
Intel® Desktop Control Center is only compatible with Intel® Desktop Boards based on the Intel® X38 Express Chipset and newer. Auto-tuning capabilities may not be available for all Extreme Series motherboards.
3
Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software, and overall
system conguration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. See www.intel.com/technology/turboboost for more information.
4
Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS, and operating system. Performance will vary
depending on the specic hardware and software you use. For more information including details on which processors support HT Technology, see www.intel.com/info/hyperthreading.
5
System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much
as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system conguration and operating system.
6
Intel® High Denition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending
on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm
7
64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not
operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software congurations. See http://developer.intel.com/technology/
intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS
OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specications and product descriptions at any time, without notice.
All products, dates, and gures specied are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, Intel Core, and Core Inside are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2009 Intel Corporation. All rights reserved. 0709/AC/MS/PDF 322330-001US
Intel® Desktop Board DP55KG Extreme Series
Technical Specications
Hardware Management Features
•Processorfanspeedcontrol
•Systemchassisfanspeedcontrol
•Voltageandtemperaturesensing
•Fansensorinputsusedtomonitorfanactivity
•PowermanagementsupportforACPI3.0b
Intel® PRO 10/100/1000 Network Connection
•Newlow-powerdesigncanmeetEnergyStar*5.0
specifications
Expansion Capabilities
•OnePCIExpress*2.0x16slot,switchabletotwo
PCIExpress2.0x8slots
•OnePCIExpress2.0x4slot
•TwoPCIExpress2.0x1slots
•TwoPCIslots
Audio
•10-channelIntel®HighDefinitionAudio
6
codec
•8-channelviathebackpanel
•2-channelviathefrontpanel
•Backpanelsupportforbothinputandoutput
via optical cable
•OneinternalheaderforS/PDIFoutputforHDMI*
support
SYSTEM MEMORY
Memory Capacity
•Four240-pinDIMMconnectorssupportingupto
two double-sided DIMMs
•Maximumsystemmemoryupto16GB
5
using 4 GB
double-sided DIMMs
Memory Types
•DDR31600/1333/1066SDRAMmemorysupport
•Non-ECCMemory
Memory Modes
•Dual-orsingle-channeloperationsupport
Memory Voltage
•1.35Vlowvoltage
•1.5VstandardJEDECvoltage
•SupportforIntel®XMPextendedvoltageprofiles
JUMPERS AND FRONT-PANEL CONNECTORS
Jumpers
•Singleconfigurationjumperdesign
•JumperaccessforBIOSmaintenancemode
Front-Panel Connectors
•Reset,HDLED,PowerLEDs,poweron/off
•Twofront-panelHi-SpeedUSB2.0headers
•Front-panelaudioheader
•OneIEEE1394aheader
MECHANICAL
Board Style
•ATX
Board Size
•9.6”x11.6”(24.38cmx29.46cm)
Baseboard Power Requirements
•ATX12V
ENVIRONMENT
Operating Temperature
•0°Cto+55°C
Storage Temperature
•-20°Cto+70°C
REGULATIONS AND SAFETY STANDARDS
United States and Canada
UL 1950, Third edition—CAN/CSA C22.2
No. 950-95 with recognized U.S. and Canadian
component marks
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