612
APPENDIX B DEVELOPMENT TOOLS
F
H
E
D
A
B
C
I
J
K
L
0.026 x 1.142 = 0.742
0.026 x 0.748 = 0.486
EV-9200GF-100-P1
ITEM MILLIMETERS INCHES
A
B
C
D
E
F
G
H
I
J
K
L
26.3
21.6
15.6
20.3
12
±
0.05
6
±
0.05
0.35
±
0.02
2.36
±
0.03
2.3
1.57
±
0.03
1.035
0.85
0.614
0.799
0.472
0.236
0.014
0.093
0.091
0.062
0.65
±
0.02 x 29 = 18.85
±
0.05
0.65
±
0.02 x 19 = 12.35
±
0.05
φ
+0.001
–0.002
+0.002
–0.002
+0.001
–0.002
+0.003
–0.002
+0.003
–0.002
+0.003
–0.002
+0.001
–0.001
+0.001
–0.002
φ
+0.001
–0.002
φ
φ
G
φ
φ
Based on EV-9200GF-100
(2) Pad drawing (in mm)
Dimensions of mount pad for EV-9200 and that for
target device (QFP) may be different in some parts.
For the recommended mount pad dimensions for
QFP, refer to “SEMICONDUCTOR DEVICE MOUNTING
TECHNOLOGY MANUAL” (C10535E).
Caution
Figure B-4. EV-9200GF-100 Recommended Footprints (For Reference Only)