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230 Appendix B
Microsoft
®
Windows
®
7 Environment Test
Vendor Type Description PN
CPU
Intel Arrandale 2.13G
(Ci3330M)
IC CP80617004122AG SLBMD C2 2.13G
PGA988
Intel Arrandale 2.26G
(Ci3350M)
IC CP80617004161AC SLBPK C2 2.26G
PGA988
Intel Arrandale 2.26G
(Ci5430M)
IC CP80617004161AD SLBPN C2 2.26G
PGA988
Intel Arrandale 2.4G
(Ci5520M)
IC CP80617004119AE SLBNB C2 2.4G
PGA988P
Intel Arrandale 2.53G
(Ci5540M)
IC CP80617004116AD SLBPG C2 2.53G
PGA988
Intel Arrandale 2.66G
(Ci7620M)
IC CP80617003981AH SLBPD C2 2.66G
PGA 988P
Intel Q3GG C2 2.13G CPU Intel Core i3 330M PGA 2.13G 35W
Arrandale, TJ90, VT, 3M L3
Intel Q3LN C2 2.26G CPU Intel Core i3 350M PGA 2.26G 35W
Arrandale, TJ90, VT, 3M L3
Intel Q3LR C2 2.26G CPU Intel Core i5 430M PGA 2.26G ARD,
uP to SC 2.53G, 3M L3
RAM SODIMM DDR3-1G 1066
SAMSUNG 1G DDR3-1066 DDR3 MODU SAM M471B2873EH1-CF8
1GB/1066
ELDIPA 1G DDR3-1066 DDR3 MODU SAM EBJ11UE6BDS0-AE-F
1GB/1066
HYNIX 1G DDR3-1066 DDR3 MODU HYN HMT112S6BFR6C-
G7N0 1G/1066
RAM SODIMM DDR3-2G 1066
MICRON 2G DDR3-1066 MT16JSF25664HZ-1G1F1
SAMSUNG 2G DDR3-1066 DDR3 MODU SAM M471B5673EH1-CF8
2G/1066
ELDIPA 2G DDR3-1066 DDR3 MODU ELP EBJ21UE8BDS0-AE-F
2G/1066
HYNIX 2G DDR3-1066 DDR3 MODU HYN HMT125S6BFR8C-
G7N0 2G/1066
RAM SODIMM DDR3-4G 1066
SAMSUNG 4G DDR3-1066 M471B5273BH1-CF8
ELPIDA 4G DDR3-1066 Memory NONE SO-DIMM DDRIII 1066 4GB
dummy P/N LF
RAM SODIMM DDR3-1G 1333
SAMSUNG 1G DDR3-1333 M471B2873FHS-CH9
RAM
SODIMM
DDR3-2G
1333
SAMSUNG 2G DDR3-1333 M471B5673FH0-CH9 LF
RAM SODIMM DDR3-4G 1333
SAMSUNG 4G DDR3-1333 M471B5273CH0-CH9