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©
2003. Renesas Technolo
gy
Corp., All ri
g
hts reserved. Printed in Japan
.
Colo
p
hon 1.0
Keep safet
y
first in
y
our circuit desi
g
ns
!
1. Renesas Technolo
gy
Corp. puts the maximum effort into makin
g
semiconductor products better and more reliable, but there is alwa
y
s the possibilit
y
that trouble
m
a
y
occur with them. Trouble with semiconductors ma
y
lead to personal in
j
ur
y
, fire or propert
y
dama
g
e
.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technolo
gy
Corp. is necessar
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to reprint or reproduce in whole or in part these materials
.
7
. If these products or technolo
g
ies are sub
j
ect to the Japanese export control restrictions, the
y
must be exported under a license from the Japanese
g
overnment and
cannot
b
e imported into a countr
y
other than the approved destination.
An
y
diversion or reexport contrar
y
to the export control laws and re
g
ulatio
n
s of Japan and/or the countr
y
of destination is prohibited
.
8. Please contact Renesas Technolo
gy
Corp. for further details on these materials or the products contained therein
.
S
ales Strate
g
ic Plannin
g
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g
., 2-6-2, Ohte-machi, Chi
y
oda-ku, Tok
y
o 100-0004, Japa
n
htt
p
://www.renesas.co
m
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