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4.1PCBLayout
Chapter4
SLWU020B–February2005–RevisedFebruary2006
PhysicalDescription
ThischapterdescribesthephysicalcharacteristicsandPCBlayoutoftheEVMandliststhecomponents
usedonthemodule.
TheEVMisconstructedona6-layer,4.77-inch×3.4-inch,0.062-inchthickPCBusingFR-4material.The
individuallayersareshowninFigure4-1throughFigure4-6.
Figure4-1.TopLayer
SLWU020B–February2005–RevisedFebruary2006PhysicalDescription11
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