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ZHONE TECHNOLOGIES ETHERNET OVER COPPER PRODUCT GUIDE
6/7
Ethernet Aggregation
4000 / 12000
IP DSLAM delivering advanced broadband services
IPD is the world’s most widely deployed Ethernet
Aggregation platform, pioneering Ethernet over
copper with N2N bonding.
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48-port SHDSL.bis bonding card
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24-port T1/E1 bonding card
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802.1p and 802.1Q
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Layer 2 switching/bridging
MALC-EFM-SHDSL-24
MALC-EFM-T1 / E1-24
MALC-EFM-SHDSL-24 NTP
MALC-EFM-SHDSL-24 NTWC
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802.1ad Q in Q transparent LAN support
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Bridging and routing support on all ports
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802.3ah (EFM) compliance with 802.3ah OAM
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N2N loop bonding support with 802.3ah
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IP SLA latency / jitter / data-loss measurements
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Layer 2 and 3 functions
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Gigabit Ethernet uplinks
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Card options for network timing
and network powering
MALC and Raptor 319, 719, 723
World-class Multi-Service Access Platform
(MSAP) supporting Ethernet Aggregation
The MALC has the highest-density
Ethernet Aggregation of any MSAP
today. 24-port SHDSL.bis or T1/E1 line
cards enable bonding across all ports.
MALC-MSAP
IPD DSLAMDSLAM
8820 / 8620
Core DSLAM functionality with 802.3ah
EFM support
Ethernet Aggregation is combined with DSLAM
functionality on an ATM and IP Platform
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24-port SHDSL.bis bonding card
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802.3ah EFM bonding
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802.1p and 802.1Q
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Layer 2 switching/bridging