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Chapter 6 167
MAINBOARD
MAIN BOARD DIS_NV11P HM55 DUAL CORE W/
CARD READER W/O CPU RAM
MB.PTY06.001
MAIN BOARD DIS_NV11P HM55 QUAD CORE W/
CARD READER W/O CPU RAM
MB.PU306.001
MAIN BOARD UMA HM55 W/CARD READER W/O
CPU RAM
MB.PTW06.001
MAIN BOARD DIS_ NV11M HM55 DUAL CORE W/
CARD READER W/O CPU RAM
MB.PTX06.001
MAIN BOARD DIS_NV11M HM55 QUAD CORE W/
CARD READER W/O CPU RAM
TBD
MEMORY
Memory ELPIDA SO-DIMM DDRIII 1066 1GB
EBJ10UE8BDS0-AE-F LF 128*8 0.065um
KN.1GB09.012
Memory SAMSUNG SO-DIMM DDRIII 1066 1GB
M471B2873EH1-CF8 LF 64*16 0.055um
KN.1GB0B.028
Memory HYNIX SO-DIMM DDRIII 1066 1GB
HMT112S6BFR6C-G7 N0 LF 64*16 0.055um
KN.1GB0G.025
Memory ELPIDA SO-DIMM DDRIII 1066 2GB
EBJ21UE8BDS0-AE-F LF 128*8 0.065um
KN.2GB09.006
Memory SAMSUNG SO-DIMM DDRIII 1066 2GB
M471B5673EH1-CF8 LF 128*8 0.055um
KN.2GB0B.012
Memory HYNIX SO-DIMM DDRIII 1066 2GB
HMT125S6BFR8C-G7 N0 LF 128*8 0.055um
KN.2GB0G.014
Memory ELPIDA SO-DIMM DDRIII 1333 1GB
EBJ10UE8BDS0-DJ-F LF 128*8 0.065um
KN.1GB09.015
Memory SAMSUNG SO-DIMM DDRIII 1333 1GB
M471B2873FHS-CH9 LF 128*8 46nm
KN.1GB0B.035
Memory ELPIDA SO-DIMM DDRIII 1333 4GB
EBJ41UF8BAS0-DJ-F LF 256*8 0.055um
KN.4GB09.001
Memory SAMSUNG SO-DIMM DDRIII 1333 2GB
M471B5673FH0-CH9 LF 128*8 46nm
KN.2GB0B.023
HEATSINK
THERMAL MODULE (DIS) 60.PU407.003
THERMAL MODULE (UMA) 60.PTW07.002
HEAT SINK 60.PTN07.008
SPEAKER
SPEAKER MODULE (WITH L/R) 23.PTN07.001
SPEAKER MODULE (WITH L/R)QMI 23.PTN07.002
MISCELLANEOUS
CATEGORY PARTNAME ACERPARTNO.