Asus E3151 Computer Hardware User Manual


 
ROG Blitz Formula 1-3
DDR2 memory support
The motherboard supports DDR2 memory that features data transfer rates of
800/667 MHz to meet the higher bandwidth requirements of the latest 3D graphics,
multimedia, and Internet applications. The dual-channel DDR2 architecture
doubles the bandwidth of your system memory to boost system performance,
eliminating bottlenecks with peak bandwidths of up to 12.8 GB/s. Furthermore, this
motherboard does not restrict the memory size across two channels. Users may
install different memory size DIMMs into the two channels and enjoy dual-channel
and single-channel functions at the same time. This new feature optimizes the use
of available memory size. See page 2-19 for details.
ASUS Super Memspeed Technology
To attain top performance, ASUS has managed to break through current FSB
and DRAM ratio proportions by utilizing Super Memspeed Technology–the latest
technology that provides even more precise overclocking options to unleash the
true potential of DDR2 memory. The DDR2 Mode maximizes system performance
by eliminating the bottleneck when overclocking both the CPU and memory–
providing great performance for 3D graphics and other memory demanding
applications. See page 2-19 for details.
Serial ATA 3.0 Gb/s technology
This motherboard supports the next-generation hard drives based on the Serial
ATA (SATA) 3Gb/s storage specication, delivering enhanced scalability and
doubling the bus bandwidth for high-speed data retrieval and saves. See page
2-33 for details.
Dual Gigabit LAN
The integrated dual Gigabit LAN design allows a PC to serve as a network
gateway for managing trafc between two separate networks. This capability
ensures rapid transfer of data from WAN to LAN without any added arbitration or
latency. See page 2-30 for details.
IEEE 1394a support
The IEEE 1394a interface provides high speed digital interface for audio/video
appliances such as digital television, digital video camcorders, storage peripherals
& other PC portable devices. See pages 2-31 and 2-35 for details.