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ASUS NCL-DS SeriesASUS NCL-DS Series
ASUS NCL-DS SeriesASUS NCL-DS Series
ASUS NCL-DS Series
1-31-3
1-31-3
1-3
Gigabit LAN solution Gigabit LAN solution
Gigabit LAN solution Gigabit LAN solution
Gigabit LAN solution
The motherboard comes with dual Gigabit LAN controllers to provide a
total solution for your networking needs. The onboard Broadcom BCM5721
Gigabit LAN controllers use the PCI Express interface and have network
throughput close to Gigabit bandwidth. See page 2-26 for details.
Serial ATA technology Serial ATA technology
Serial ATA technology Serial ATA technology
Serial ATA technology
The motherboard supports the Serial ATA technology through the Serial ATA
interfaces controlled by the Intel
®
ICH5R. The SATA specification allows for
thinner, more flexible cables with lower pin count, reduced voltage
requirement, and up to 150 MB/s data transfer rate.
Built-in SATA RAID solutionBuilt-in SATA RAID solution
Built-in SATA RAID solutionBuilt-in SATA RAID solution
Built-in SATA RAID solution
The Intel
®
ICH5R allows RAID 0 and RAID 1 configuration for two SATA
connectors and supports the Intel
®
Matrix Storage Technology. See page
2-28 for details.
USB 2.0 technology USB 2.0 technology
USB 2.0 technology USB 2.0 technology
USB 2.0 technology
The motherboard implements the Universal Serial Bus (USB) 2.0
specification, dramatically increasing the connection speed from the
12 Mbps bandwidth on USB 1.1 to a fast 480 Mbps on USB 2.0. USB 2.0 is
backward compatible with USB 1.1. See pages 2-26 and 2-30 for details.
Temperature, fan, and voltage monitoringTemperature, fan, and voltage monitoring
Temperature, fan, and voltage monitoringTemperature, fan, and voltage monitoring
Temperature, fan, and voltage monitoring
The CPU temperature is monitored by the ASIC (integrated in the Winbond
hardware monitor) to prevent overheating and damage. The system fan
rotations per minute (RPM) is monitored for timely failure detection. The
ASIC monitors the voltage levels to ensure stable supply of current for
critical components. See page 4-31 for details.