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DCKEXT U24_X1
U24_X2
RMCK MCKEXT
U25_X1
POWERON
U25_X2
RDCK
POWERON
DCKEXT
MCKEXT
3.3V
GND
KEYSTONE
VDD
SDA
SCL
3.3V
3.3V
3.3V
3.3V
3.3V
VDD
VDD
3.3V
VDD
3.3V
KEYSTON_A
KEYSTON_A
Title
Size Document Number Rev.
Date: Sheet
of
Project Code
Reviewed By Approved By
Prepared By
Model Name
PCB P/N
PCB Rev.
Benq Corporation
OEM/ODM Model Name
48.J8601.S04
MAIN BOARD
11 20
DAVID HN LIN KELVIN LIAO
99.J8677.B12-C3-304-004S04
ANGEL HU
<Size>
PB610099.J8677.001
1
Tuesday, October 07, 2003
<OEM/ODM>
65MHz
130MHz/41MHz
Note: keystone function IC and thermal senser IC, those two component should be placement as closed as possible.
S01 version I2C bus reversed and Pin8 connected to VDD
new version change to 3.3V
MEMSIC: R93, C91, R94, R95, R92, RK1, OPEN; RK2, RK3, RK4 0ohm
ADI: RK1, RK2, RK3, RK4, R92 OPEN
OPEN
OPEN
68.00129.0D1
68.00129.0D1
RK8
0
R115
820K
R114
820K
U19
XFILT
7
YFILT
6
ST
1
T2
2
VDD
8
COM
3
XOUT
5
YOUT
4
C123
10P D
C121
0.1U
RK5
OPEN
CP6
0.1U
25V Z
RK9
4.7K
RK3
OPEN
C89
0.1U
RK2
OPEN
U18
G751-2
A2
5
A1
6
A0
7
VCC
8
SDA
1
SCL
2
O.S.
3
GND
4
L29
Z10
C124
10P D
U20
74AHC1G08
1
2
3
4
5
C125
10P D
Y3
16.257MHZ
R92
OPEN
C92
470N M
R113
22
U25
ICS501
X1
1
X2
8
CLK
5
S0
6
S1
4
OE
7
VDD
2
GND
3
RK1
0
R95
680K
L28
Z10
RK7
0
CK1 0.1U
Y2
16.257MHZ
C126
10P D
C122
0.1U
R93
0
R112
22
C91
470N M
RK4
OPEN
R94
4.7K
C93
0.1U
U24
ICS501
X1
1
X2
8
CLK
5
S0
6
S1
4
OE
7
VDD
2
GND
3