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NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it may be necessary to move the fan/heat sink
assembly from side to side to detach the assembly.
4. Remove the fan/heat sink assembly (3).
The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly (1),
(3) and the processor (2) and video components (4) each time the fan/heat sink assembly is
removed. Thermal pads and thermal paste must be installed on all surfaces before the fan/heat sink
assembly is reinstalled.
NOTE: Thermal pads and thermal paste are included with all fan/heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the locations for thermal material on systems with discrete graphics
subsystems.
Component replacement procedures 81