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iv Maintenance and Service Guide
Contents
3 Illustrated Parts Catalog
3.1 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . 3–1
3.2 Notebook System Major Components . . . . . . . . . . . 3–2
3.3 Miscellaneous Plastics Kit Components . . . . . . . . 3–16
3.4 Mass Storage Devices . . . . . . . . . . . . . . . . . . . . . . 3–18
3.5 Miscellaneous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–22
4 Removal and Replacement Preliminaries
4.1 Tools Required. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
4.2 Service Considerations. . . . . . . . . . . . . . . . . . . . . . . 4–2
Plastic Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2
Cables and Connectors. . . . . . . . . . . . . . . . . . . . . . . 4–2
4.3 Preventing Damage to Removable Drives . . . . . . . . 4–3
4.4 Preventing Electrostatic Damage . . . . . . . . . . . . . . . 4–4
4.5 Packaging and Transporting Precautions. . . . . . . . . 4–4
4.6 Workstation Precautions . . . . . . . . . . . . . . . . . . . . . 4–5
4.7 Grounding Equipment and Methods . . . . . . . . . . . . 4–6
5 Removal and Replacement Procedures
5.1 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2
5.2 Disassembly Sequence Chart . . . . . . . . . . . . . . . . . . 5–2
5.3 Preparing the Notebook for Disassembly . . . . . . . . 5–4
5.4 Notebook Feet . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11
5.5 Mini PCI Communications Board . . . . . . . . . . . . . 5–12
5.6 Disk Cell RTC Battery. . . . . . . . . . . . . . . . . . . . . . 5–15
5.7 Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17
5.8 Memory Expansion . . . . . . . . . . . . . . . . . . . . . . . . 5–22
5.9 TouchPad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–25
279362-003.book Page iv Monday, May 19, 2003 1:28 PM