Filter
Top Products
CY62138EV30
MoBL
®
Document #: 38-05577 Rev. *A Page 4 of 9
Thermal Resistance
Parameter Description Test Conditions BGA Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 x 4.5 inch, four-layer
printed circuit board
72 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
8.86 °C/W
AC Test Loads and Waveforms
Parameters 2.50V 3.0V Unit
R1 16667 1103 Ω
R2 15385 1554 Ω
R
TH
8000 645 Ω
V
TH
1.20 1.75 V
Data Retention Characteristics (Over the Operating Range)
Parameter Description Conditions Min. Typ.
[3]
Max. Unit
V
DR
V
CC
for Data Retention 1 V
I
CCDR
Data Retention Current V
CC
= 1V, CE > V
CC
− 0.2V,
V
IN
> V
CC
− 0.2V or V
IN
< 0.2V
0.8 3 µA
t
CDR
[7]
Chip Deselect to Data Retention Time 0 ns
t
R
[8]
Operation Recovery Time t
RC
ns
V
CC
V
CC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
OUTPUT V
TH
Equivalent to: THÉVENIN EQUIVALENT
ALL INPUT PULSES
R
TH
R1
Fall time: 1 V/ns
Rise Time: 1 V/ns
Data Retention Waveform
Notes:
7. Tested initially and after any design or process changes that may affect these parameters.
8. Full Device AC operation requires linear V
CC
ramp from V
DR
to V
CC(min.)
> 100 µs or stable at V
CC(min.)
> 100 µs.
1.5V
t
CDR
V
DR
> 1.5 V
DATA RETENTION MODE
t
R
CE
V
CC
V
CC
(min.)
[+] Feedback