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CY62148E MoBL
®
Document #: 38-05442 Rev. *F Page 4 of 10
Thermal Resistance
[10]
Parameter Description Test Conditions
SOIC
Package
TSOP II
Package
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
75 77 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
10 13 °C/W
AC Test Loads and Waveforms
Parameters 5.0V Unit
R1 1800 Ω
R2 990 Ω
R
TH
639 Ω
V
TH
1.77 V
Data Retention Characteristics (Over the Operating Range)
Parameter Description Conditions Min Typ
[3]
Max Unit
V
DR
V
CC
for Data Retention 2 V
I
CCDR
Data Retention Current V
CC
= V
DR
, CE > V
CC
– 0.2V,
V
IN
> V
CC
– 0.2V or V
IN
< 0.2V
Ind’l/Auto-A 1 7 µA
t
CDR
[10]
Chip Deselect to Data Retention Time 0 ns
t
R
[11]
Operation Recovery Time t
RC
ns
Data Retention Waveform
3.0V
V
CC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns
Fall Time = 1 V/ns
OUTPUT V
Equivalent to:
THEVENIN EQUIVALENT
ALL INPUT PULSES
R
TH
R1
V
CC(min)
V
CC(min)
t
CDR
V
DR
> 2.0V
DATA RETENTION MODE
t
R
V
CC
CE
Note
11. Full device operation requires linear V
CC
ramp from V
DR
to V
CC(min)
> 100 µs or stable at V
CC(min)
> 100 µs.
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