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MoBL
®
CY62148EV30
Document #: 38-05576 Rev. *G Page 2 of 12
Pin Configuration
[1, 3]
Product Portfolio
Product Range V
CC
Range (V)
Speed
(ns)
Power Dissipation
Operating I
CC
(mA)
Standby I
SB2
(µA)
f = 1 MHz f = f
max
Min Typ
[4]
Max Typ
[4]
Max Typ
[4]
Max Typ
[4]
Max
CY62148EV30LL VFBGA Ind’l 2.2 3.0 3.6 45 2 2.5 15 20 1 7
TSOP II Ind’l/Auto-A
SOIC Ind’l 2.2 3.0 3.6 55 2 2.5 15 20 1 7
A
15
V
CC
A
13
A
12
A
5
NC
WE
A
7
IO
4
IO
5
A
4
IO
6
IO
7
V
ss
A
11
A
10
A
1
V
SS
IO
0
A
2
A
8
A
6
A
3
A
0
V
cc
IO
1
IO
2
IO
3
A
17
A
18
A
16
CE
OE
A
9
A
14
D
E
B
A
C
F
G
H
NC
36-Ball VFBGA Pinout
Top View
1
2
3
4
5
6
7
8
9
10
11
14
31
32
12
13
16
15
29
30
21
22
19
20
27
28
25
26
17
18
23
24
32-Pin SOIC/TSOP II Pinout
Top View
A
17
A
16
A
15
A
14
A
13
A
12
A
11
A
10
A
9
A
8
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
IO
0
IO
1
IO
2
IO
3
IO
4
IO
5
IO
6
IO
7
V
SS
V
CC
A
18
WE
OE
CE
Notes
3. NC pins are not connected on the die.
4. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= V
CC(typ)
, T
A
= 25°C.
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