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CY7C1370D
CY7C1372D
Document #: 38-05555 Rev. *F Page 19 of 28
Note:
18.Tested initially and after any design or process change that may affect these parameters.
Capacitance
[18]
Parameter Description Test Conditions
100 TQFP
Max.
119 BGA
Max.
165 FBGA
Max. Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
DD
= 3.3V.
V
DDQ
= 2.5V
589pF
C
CLK
Clock Input Capacitance 5 8 9 pF
C
I/O
Input/Output Capacitance 5 8 9 pF
Thermal Resistance
[18]
Parameter Description Test Conditions
100 TQFP
Package
119 BGA
Package
165 FBGA
Package Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA/JESD51.
28.66 23.8 20.7 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
4.08 6.2 4.0 °C/W
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50Ω
Z
0
= 50Ω
V
T
= 1.5V
3.3V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50Ω
Z
0
= 50Ω
V
T
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load
AC Test Loads and Waveforms
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