Cypress CY7C1470BV33 Computer Hardware User Manual


 
CY7C1470BV33
CY7C1472BV33, CY7C1474BV33
Document #: 001-15031 Rev. *C Page 20 of 30
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied ............................................ –55°C to +125°C
Supply Voltage on V
DD
Relative to GND........–0.5V to +4.6V
Supply Voltage on V
DDQ
Relative to GND.......–0.5V to +V
DD
DC to Outputs in Tri-State....................–0.5V to V
DDQ
+ 0.5V
DC Input Voltage ................................... –0.5V to V
DD
+ 0.5V
Current into Outputs (LOW) ........................................ 20 mA
Static Discharge Voltage.......................................... > 2001V
(MIL-STD-883, Method 3015)
Latch Up Current................................................... > 200 mA
Operating Range
Range
Ambient
Temperature
V
DD
V
DDQ
Commercial 0°C to +70°C 3.3V
–5%/+10%
2.5V – 5%
to V
DD
Industrial –40°C to +85°C
Electrical Characteristics
Over the Operating Range
[13, 14]
Parameter Description Test Conditions Min Max Unit
V
DD
Power Supply Voltage 3.135 3.6 V
V
DDQ
IO Supply Voltage For 3.3V IO 3.135 V
DD
V
For 2.5V IO 2.375 2.625 V
V
OH
Output HIGH Voltage For 3.3V IO, I
OH
=4.0 mA 2.4 V
For 2.5V IO, I
OH
=1.0 mA 2.0 V
V
OL
Output LOW Voltage For 3.3V IO, I
OL
= 8.0 mA 0.4 V
For 2.5V IO, I
OL
= 1.0 mA 0.4 V
V
IH
Input HIGH Voltage
[13]
For 3.3V IO 2.0 V
DD
+ 0.3V V
For 2.5V IO 1.7 V
DD
+ 0.3V V
V
IL
Input LOW Voltage
[13]
For 3.3V IO –0.3 0.8 V
For 2.5V IO –0.3 0.7 V
I
X
Input Leakage Current
except ZZ and MODE
GND V
I
V
DDQ
–5 5 μA
Input Current of MODE Input = V
SS
–30 μA
Input = V
DD
5 μA
Input Current of ZZ Input = V
SS
–5 μA
Input = V
DD
30 μA
I
OZ
Output Leakage Current GND V
I
V
DDQ,
Output Disabled –5 5 μA
I
DD
[15]
V
DD
Operating Supply V
DD
= Max., I
OUT
= 0 mA,
f = f
MAX
= 1/t
CYC
4.0-ns cycle, 250 MHz 500 mA
5.0-ns cycle, 200 MHz 500 mA
6.0-ns cycle, 167 MHz 450 mA
I
SB1
Automatic CE
Power Down
Current—TTL Inputs
Max. V
DD
, Device Deselected,
V
IN
V
IH
or V
IN
V
IL
,
f = f
MAX
= 1/t
CYC
4.0-ns cycle, 250 MHz 245 mA
5.0-ns cycle, 200 MHz 245 mA
6.0-ns cycle, 167 MHz 245 mA
I
SB2
Automatic CE
Power Down
Current—CMOS Inputs
Max. V
DD
, Device Deselected,
V
IN
0.3V or V
IN
> V
DDQ
0.3V,
f = 0
All speed grades 120 mA
Notes
13.Overshoot: V
IH
(AC) < V
DD
+1.5V (pulse width less than t
CYC
/2). Undershoot: V
IL
(AC)> –2V (pulse width less than t
CYC
/2).
14.T
Power-up
: assumes a linear ramp from 0V to V
DD
(min.) within 200 ms. During this time V
IH
< V
DD
and V
DDQ
< V
DD
.
15.The operation current is calculated with 50% read cycle and 50% write cycle.
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