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16 Chapter 1
Throttling 50%: On= 90°C; OFF=80°C
OS shut down at 95°C; H/W shut down at 85°C
North Bridge Specifications
South Bridge Specifications
System Memory
Video Specifications
Item Specification
Chipset Intel Crestline GS45 SFF
Package FCBGA 1363 balls
Features • Processor hosts bus supports 667/800/1066MHz FSB support.
• Supports Dual Channel DDR2 SDRAM at 667/800MHz
• Integrated SDRAM controller up to 8GB (2 SODIMM support)
• DMI x2 and DMI x4 for connection between GMCH and ICH9M
Item Specification
Chipset ICH9M SFF
Package BGA 676 balls
Features • Upstream accelerated Hub architecture interface for access to
GMCH.
• PCI Express Base Specification, Revivsion 1.1 support.
• PCI 2.3 interface. (4 PCI Request/Grant pairs).
• ACPI Power Management Logi Support.
• Enhanced DMA controller, interupt controller, timers functions.
• Integrated Serial ATA host controllers with independent DMA
operation on six ports and AHCI support.
• USB 1.1 and USB 2.0 Host controllers.
• Supports Intel High Definition Audio (Intel HD Audio) Interface.
• Supports Intel® Matrix Storage Technology.
• Supports Intel® Active Mangement Technology.
• Low Pin Count (LPC) interface.
• 6 PCle ports.
Item Specification
Memory size 0MB (No on-board Memory)
DIMM socket number 2 sockets
Supports memory size per socket 2GB
Supports maximum memory size 4GB for 64bit OS (with two 2GB SO-DIMM)
Supports DIMM type DDR2 Synchronous DRAM
Supports DIMM Speed 800/667 MHz
Item Specification
Chipset Intel® GS45 Express Chipset
Package • 1329-ball FCBGA
• Size: 34mm x 34mm
• Ball pitch: 0.7mm