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6. Remove the heat sink assembly (2).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly
and system board components, it may be necessary to move the heat sink assembly from side to side to
detach it.
7. Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of
the heat sink assembly and the system board components each time the heat sink assembly is
removed. Replacement thermal material is included with the heat sink assembly and system board
spare part kits. Thermal paste is used on the processor (1) and the heat sink assembly section (2) that
services it.
Reverse this procedure to install the heat sink assembly on computer models equipped with UMA graphics.
62 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts