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g. Keyboard (see Keyboard on page 86)
h. Base enclosure (see
Base enclosure on page 91)
i. System board (see
System board on page 107)
Remove the heat sink:
NOTE: Steps 1 and 2 apply to computer models equipped with a graphics subsystem with discrete
memory. See steps 3 and 4 for heat sink removal information for computer models equipped with a
graphics subsystem with UMA memory.
1. Following the 1, 2, 3, 4, 5, 6 sequence stamped into the heat sink, loosen the six captive Philllips
screws (1) and (2) that secure the heat sink to the system board.
2. Remove the heat sink (3).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE: Steps 3 and 4 apply to computer models equipped with a graphics subsystem with
UMA memory. See steps 1 and 2 for heat sink removal information for computer models
equipped with a graphics subsystem with discrete memory.
3. Following the 1, 2, 3, 4 sequence stamped into the heat sink, loosen the four captive Philllips
screws (1) that secure the heat sink to the system board.
4. Remove the heat sink (2).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
Component replacement procedures 111