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HP BladeSystem c3000 Enclosure technologies
technology brief
Abstract.............................................................................................................................................. 2
Overview of HP BladeSystem c3000 Enclosure ....................................................................................... 2
HP Thermal Logic technologies .............................................................................................................. 4
Active Cool fans .............................................................................................................................. 5
HP PARSEC architecture.................................................................................................................... 6
Thermal Logic for the server blade and enclosure................................................................................. 7
Power supplies and enclosure power subsystem................................................................................... 8
HP BladeSystem Power Sizer ......................................................................................................... 9
Pooled power ............................................................................................................................ 10
Dynamic Power Saver mode ........................................................................................................ 11
Power Regulator......................................................................................................................... 11
Power Capping for each server blade........................................................................................... 11
Interconnect options and infrastructure.................................................................................................. 12
Fabric connectivity and port mapping............................................................................................... 13
Virtual Connect.............................................................................................................................. 16
Enclosure-based DVD ROM................................................................................................................. 17
Onboard Administrator ...................................................................................................................... 17
Insight Display ............................................................................................................................... 19
Web GUI...................................................................................................................................... 20
Command-line interface .................................................................................................................. 20
Onboard Administrator cabling ....................................................................................................... 20
Enclosure link cabling..................................................................................................................... 20
Recommendations.............................................................................................................................. 21
Summary .......................................................................................................................................... 21
Appendix A. Acronyms in text............................................................................................................. 22
Appendix B. Fan, power supply, and device bay population guidelines................................................... 23
For more information.......................................................................................................................... 28
Call to action .................................................................................................................................... 28