![](http://pdfasset.owneriq.net/b/8a/b8a5531d-6346-45da-96bd-becb2b77106b/b8a5531d-6346-45da-96bd-becb2b77106b-bg5c.png)
NOTE: The following illustration shows the replacement thermal material locations on a computer
model equipped with an AMD processor and a graphics subsystem with UMA memory. Thermal paste
is used on the processor (1) and the heat sink section (2) that services it.
NOTE: The following illustration shows the replacement thermal material locations on a computer
model equipped with an Intel processor and a graphics subsystem with discrete memory.
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Thermal paste is used on the processor (1) and the heat sink section (2) that services it
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Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it
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Thermal pads are used on the system board components (5) and the heat sink sections (6) that
service them
84 Chapter 4 Removal and replacement procedures