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3. Remove the fan/heat sink assembly (3).
NOTE: Due to the adhesive quality of the thermal paste and thermal pads located between
the fan/heat sink assembly and system board components, it may be necessary to move the
fan/heat sink assembly from side to side to detach the assembly.
NOTE: The thermal paste and thermal pads should be thoroughly cleaned from the surfaces of
the fan/heat sink assembly (1) and the system board components (2) each time the fan/heat sink
assembly is removed. Thermal paste and thermal pads are included with all system board, fan/
heat sink assembly, and processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
ENWW Component replacement procedures 73