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3. Remove the fan/heat sink assembly (3).
NOTE: Due to the adhesive quality of the thermal paste and thermal pads located between the
fan/heat sink assembly and system board components, it may be necessary to move the fan/heat
sink assembly from side to side to detach the assembly.
NOTE: The thermal paste and thermal pads should be thoroughly cleaned from the surfaces of the fan/
heat sink assembly (1) and the system board components (2) each time the fan/heat sink assembly is
removed. Thermal paste and thermal pads are included with all system board, fan/heat sink assembly,
and processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures 67